This conference was held under the guidance of the China Technology Entrepreneurship Association, the Shanghai Municipal Economic and Information Technology Commission, the Shanghai Association for Science and Technology, the Management Committee of Shanghai Hongqiao International Central Business District, and the People's Government of Minhang District, Shanghai. It was organized by the National Integrated Circuit Innovation Center, the Shanghai Instrument and Meter Industry Association, and Caijing News Agency, with the support of the Fudan University Institute of Optoelectronic Research, Fuchuangxin, The Sci-Tech Innovation Daily, Shanghai Nanhongqiao Investment and Development (Group) Co., Ltd., and the Shanghai Duanhe Duan (Hongqiao International Central Business District) Law Firm, among others. The China Shanghai Testing Center and the Shanghai Integrated Circuit Industry Association also contributed as co-sponsors. Instrument Information Network, Semiconductor Comprehensive Research, and the official website of the Shanghai Vacuum Society served as supporting media for the conference, collectively contributing to its successful hosting.
Experts and professors from the semiconductor inspection field, including CAS Member and Director of the Institute of Optoelectronics at Fudan University, Chu Junhao; CAE Member and Dean of the School of Optoelectronic Information and Computer Engineering at Shanghai University of Science and Technology, Zhuang Songlin; and Xu Dongmei, Deputy Secretary-General of the China Semiconductor Industry Association and Secretary-General of the Packaging and Testing Branch, among many other academic and industry leaders, will attend the event. Additionally, over 100 companies such as Zhongke FeiCe, Shanghai JingCe, RIGOL, NAURA, TF Microelectronics, Suzhou Tianzhun, and Changchuan Technology, along with more than 500 guests, will participate in the conference discussions.
At the opening ceremony of the conference, Zhuang Songlin, academician of the CAE Member, Li Kanghong, deputy director of the management committee of Shanghai Hongqiao International CBD, and Shen Xiaoliang, deputy general manager of the National Integrated Circuit Innovation Center addressed the conference.
congress report
The following conference report was presided over by Lu Hongliang, professor of the School of Microelectronics of Fudan University and executive chairman of the conference, Shen Lei, deputy general manager of Shanghai Fudan Microelectronics Group Co., Ltd., Xu Dongmei, deputy secretary-general and secretary-general of the Sealing and Testing Branch of the China Semiconductor Industry Association, secretary-general of the Alumni Association of the Microelectronics Industry of Xi'an Jiaotong University, Chu Junhao, president of the Institute of Optoelectronics of Fudan University and academician of the CAS Member, and Tang Wenxin, chairman of Yuanxiang Micro Technology Co., Ltd., former director of the ultra transient device laboratory, and director of scientific research cooperation of the Electronic Microscope Center, successively brought wonderful sharing.
Sub venue Report
The scale of this conference is unprecedented. In addition to the opening ceremony report on the morning of the 12th, 15 sub conference presentations were also set up, including integrated circuit wafer level defect detection technology, semiconductor device reliability and failure analysis, advanced manufacturing and packaging technology of integrated circuits, semiconductor testing equipment and core components. Multiple sub conference presentations were held simultaneously in three venues, and experts and scholars gathered together like a feast of knowledge and wisdom. The guest speakers enthusiastically shared their research results or enterprise technologies; The audience was fully focused, sometimes bowing their heads to record, and sometimes recording the exciting moments of the report in a timely manner. The attendees jointly delved into the latest developments in semiconductor materials, processes, and devices in industries such as integrated circuits, new energy, displays, LEDs, and automotive electronics, constantly colliding with each other's thoughts and sparks of wisdom bursting forth here. This academic and business exchange event will undoubtedly have a profound impact on the development of the semiconductor industry.
Manufacturer Exhibition
In addition to the exciting presentations, several well-known domestic companies' booths were also carefully arranged outside the venue, such as Agilent, PerkinElmer, Anhui Jianxing, Northern Huachuang, Baiji Nano, Zhizhen Precision, Puyuan Jingdian, Jiangling Technology, Yinguan Semiconductor, etc. They showcased their new technologies and equipment in the field of semiconductor quantity testing.
The executive chairman of this conference, Professor Lu Hongliang from the School of Microelectronics at Fudan University, and the initiator of Fosun Chip, introduced that in recent years, the competition in basic research, technological paths, and industrial applications around the integrated circuit industry has become increasingly fierce. It is urgent to build an infrastructure system for high-quality innovative development of China's integrated circuit industry, develop corresponding industry technical standards and testing methods, and vigorously enhance advanced testing equipment and instruments for the semiconductor industry. This conference has established a cooperation platform for innovation chain, industry chain, and supply chain through various forms such as conference reports, branch reports, product exhibitions, scientific research achievements displays, and academic posters. It provides opportunities for cooperation in the transfer and transformation of scientific and technological achievements in universities, a stage for semiconductor testing and testing equipment and instrument enterprises to showcase technology and products, and a business environment and investment direction for local governments.